Your TPL Legal Team is experienced in a wide range of electronics and electrical engineering technologies, including but not limited to:
Apparatus and associated methods relate to a lead that includes metallic traces sandwiched between layers of polymers to form a ribbon (e.g., similar to a flex circuit). In an illustrative example, areas on both ends
Apparatus and associated methods relate to automatically load matching, in time, energy physically generated and transmitted to a consumption location across at least one tracking and processing infrastructure. In an illustrative example, a load pool
Apparatus and associated methods relate to a Self-Validating System (SVS) which includes an Electronic Self-Validating Module (ESVM) that may be employed within a medical device, operable to receive and to transmit wireless transmissions to and
Apparatus and associated methods relate to pairing a receiver with an emitter based on a presence of an amplitude of a spectral profile at at least one predetermined frequency. In an illustrative example, a receiver
Apparatus and associated methods relate to generating a wiring schema with more than one safety device sharing at least one test signal through one or more external terminal blocks when the number of terminals required
Apparatus and associated methods relate to a Meissner Engine Regulator (MER) that includes a superconducting inductive element (SCIE) supplying a secondary winding coupled to recirculate excess energy from the SCIE core to a feedback winding
A temporary pacing lead has an atraumatic curled distal region with multiple cathodes and distal pressure measurement to allow positioning and repositioning within the heart chamber without fluoroscopic or echo guidance. The curled distal region
Apparatus and associated methods relate to a vibrational sensing system (VSS) including an accelerometer and a data processor, which determines an “operational state” of a mechanical drive unit, the processor further employing the “operational state”
Apparatus and associated methods relate to providing an integrated circuit package having (a) a bypass circuit in parallel with an inductor and (b) a logic circuit configured to control the bypass circuit for conductivity modulation.
