Apparatus and associated methods relate to providing an integrated circuit package having (a) a bypass circuit in parallel with an inductor and (b) a logic circuit configured to control the bypass circuit for conductivity modulation. In an illustrative example, in response to a corresponding load transient, the logic circuit may include a state machine configured to generate different control signals for the bypass circuit to control the timing and/or quantity of energy transfer from the inductor to a load. The bypass circuit may include a first semiconductor switch and a second semiconductor switch connected in anti-series. In some implementations, the power stage and the bypass circuit may be operated, for example, in numerous operational modes to dynamically modulate conductivity across the terminals of the inductor in a power supply to advantageously result in a smaller undershoot and overshoot.
